IPC Conference Paper Archive

Solder joints tend to crack after extended thermal cycling,if the component and the circuit board are CTE mis-matched. Predicting this t-cycle lifetime is critical in optimizing product design .. read more

The low Ag solder alloy shows higher drop performance than the high Ag solder alloy in the every kind of package and board combinations. This is related to the ductility of solder and the surfa .. read more

As some of the reliability issues and cost associated with tin silver copper solders become more apparent,alternative pb-free solder formulations are being considered. Of particular interest ar .. read more

The fabrication of EPAD PWBs have come about in response to the pursuit of reduction in real estate,demand for improved electrical characteristics and higher durability and reliability needs fr .. read more

In order to meet the never ending desire for smaller and cheaper electronics,many companies are pursuing the use of embedded passive technologies. There are several examples of embedded capacit .. read more

Phenolic cure of epoxy resins produces high glass transition temperature materials for electrical laminates fabrication. These resins are brittle due to the high crosslink densities. Consequent .. read more

Nickel plating is often used on PWBs to increase wear resistance and to prevent diffusion between copper and other plated metals. The nickel plating is often present in through holes as well as .. read more

Embedded passives technology offers high-density high-performance solutions,but needs characterization before becoming a resource in harsh-environment applications. This paper discusses two cri .. read more

As electronics manufacturing,design and after market services evolve into as a strategic option for today’s electronics original equipment manufacturers (OEM),opportunities for further growth e .. read more

This paper will compare the current capabilities of raw material suppliers to the PWB industry to those same capabilities 10 and 20 years ago. Key raw materials such as resin,glass fabric,coppe .. read more

The growth of portable wireless products and related consumer electronics is fueling a major outsourcing effort towards Asia. Most OEM (original equipment manufacturers) are partnering with CMs .. read more

As the frontiers of feature size and interspace between devices become ever challenging,we as an industry have to start revaluating the performance of the toolsets that are used in the SMT aren .. read more

As small surface-mount components such as 0201 and 01005 packages have entered volume assembly,manufacturers are observing increased instances of poor solder coalescence during reflow. The root .. read more

Fine solder powder paste applications continue to grow as a cost effective solution to many semiconductor packaging needs. Applications for solder paste continue to evolve from the standard SMT .. read more

Rarely do PCB manufacturers have the resources for purchasing an inspection machine for every stage of the manufacturing process. Typically,therefore,they have to decide whether to deploy AOI p .. read more

It is understood that the solder paste printing process presents far more opportunities for defects than any of the other individual Surface Mount Technology (SMT) Manufacturing Processes. In a .. read more

To select an optimal test strategy,good knowledge of defect levels and test effectiveness are two very important factors to include. In 1999 an industry defect level study was completed and was .. read more

Prisma is a PCB-Engineering software developed by DYCONEX AG,Switzerland (manufacturer of PCBs). Compared to existing solutions on the market it allows for broad standardization of the process .. read more

Traceability and process control are no longer requirements reserved for manufacturers in regulatory or specific market segments. Today,all manufacturers who aspire to achieve or to maintain a .. read more

Lean manufacturing is far from a new concept,and many within the Electronics Assembly (EA) industry are already familiar with the principles and concepts behind it. However,in spite of widespre .. read more

Currently environment-friendly PCBs (including lead-free assembly compatible PCB and halogen-free PCB) become popular in PCB industry to meet the requirements of environmental protection. Corre .. read more

With the increased use of High Density Interconnects in printed wiring boards (PWB) there is a critical need for reliable methods to completely fill through hole and blind vias. Complete fillin .. read more

Nickel plating is often used on PWBs to increase wear resistance and to prevent diffusion between copper and other plated metals. The nickel plating is often present in through holes as well as .. read more

Design workflow is the core to your design team?s competitive advantage; it?s the conduit by which you turn your team?s expertise and ideas into manufacturable products. And yet,all engineering .. read more

Total cost of ownership is a financial estimate designed to help consumers and enterprise managers assess direct and indirect costs commonly related to software or hardware. It is a form of ful .. read more

Kitting is the first step in printed circuit board assembly. It is initiated well in advance of actual production start to be able to prepare and deliver the kit on time. Kitting involves gathe .. read more

The SMT industry is going through a challenging phase of assembling miniature components,such as micro BGA,0.3mm CSP and 01005 passives onto Printed Circuit Boards (PCB). This effort is primari .. read more

Tombstoning,the phenomena where a chip component stands up on one end during the reflow cycle,is well-documented and understood in tin-lead systems. It is reported to occur more frequently in l .. read more

Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon .. read more

Repairing a PCB with a defective BGA,uBGA,or QFN is often a difficult and tedious task. The conventional method is to remove the defective device from the PCB; clean the pads on the PCB,then pr .. read more

Wire soldering operations are still widely accepted in the electronics assembly industry. When a product or the parts within cannot withstand the heat of oven reflow,the localized heat provided .. read more

Currently little data exists on temperature repeatability of BGA/CSP rework machine equipment. This is an issue especially for lead-free rework as the temperatures during lead-free BGA/CSP rewo .. read more

There has been a global trend towards legislation meant to encourage sustainable manufacturing and minimize the environmental impact of product manufacturing. In the global economy,with its dis .. read more

Companies not only need to understand the reliability issues with environmental compliance,but also how to comply with the various regulations from the business end. China is the second jurisdi .. read more

More and more political bodies (countries,states,and unions) are enacting legislation designed to protect the environment from the impact of manufacturing. One category of restrictive legislati .. read more

Emerging technologies in the printed circuit board industry including smaller holes,higher aspect ratios,three-dimensional features,fine pitch,blind via holes,and new lead free materials contin .. read more

An electrochemical device has been developed that deposits non adherent copper metal powder at the cathode,and generates chlorine gas at the anode. The chlorine is contained within the system,a .. read more

We have developed a cupric chloride-hydrochloric acid based microetchant process. This process provides a unique roughened copper surface,which yields excellent adhesion for both solder mask an .. read more

The phrase "Design For Manufacture" strongly implies the use of manufacturing information while making of design decisions or,in other words,incorporating manufacturing knowledge during initial .. read more

The proper grounding of all conductive items in the production workplace is an essential element of ESD (electrostatic discharge) management. ESD damage to components and assemblies in manufact .. read more

In this report,BGA packages with conventional and green material combination were selected as test vehicles for the investigation of MSL/temperature rating at the packaging level. The IC packag .. read more

As early as 2001,leading cellular phone manufacturers had established stable assembly processes that were RoHS compliant for their cellular phone products. Since this time,the products manufact .. read more

This paper reports the results of an evaluation of tin mitigation processes for components,i.e. converting parts with pure tin (Sn) and other lead-free (Pb-free) finishes to tin-lead (SnPb) fin .. read more

It is known that pure tin will undergo an allotropic transformation below 13°C where it becomes a semiconductor with a 26% [1,2] volume increase,and in appearance turns from a bright shiny m .. read more

Concerns There are some areas that must be accepted if planning to run the newest SENIG process: - Slower plating rate in nickel (to get 150µ“ it will take 20 minutes) - It works better at hig .. read more

Immersion silver chemistry has been promoted as a final finish for solderability for several years now. There are different commercially available products that will deposit silver in a wide ra .. read more

Since the European 2002/95/EC RoHS directive enforcement on 1st July 2006,a dominating part of the electronic industry suppressed the use of Pb in electronic equipment. As one of the consequenc .. read more

For companies that choose to take the Pb-free exemption under the European Union’s RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products,there is a growing concern abo .. read more

Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon .. read more

We demonstrate here a novel CCL (Copper Clad Laminate),which exhibits an extremely low transmission loss at mm-wave band. The CCL,which we developed,is based on a new fluoropolymer with adhesiv .. read more