IPC Conference Paper Archive

Electronics,especially mobile electronic items,are subjected to unintentional abuse by having various beverages spilled onto or into them. Ion Chromatography and emission spectroscopy were used .. read more

All things corrode,and the rate of corrosion among electronics devices is accelerating. Electronic devices are being used in more places than ever before. They are finding more uses,they're mor .. read more

Various forms of contamination on the surface of hydrocarbon ceramic dielectric PWBs have been observed following component population. Although contamination is occasionally observed on PWBs f .. read more

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The recent need to develop lead-free electrical and electronic products has resulted in an increased demand to characterize solder joint integrity. Many standards exist to evaluate the long ter .. read more

Low-pressure plasmas have been used for many years to surface clean and functionalize substrates prior to downstream converting operations; therefore,the benefits of plasma treatment are well r .. read more

The complexity of the electronic assembly manufacturing environment increases with the miniaturization,low standoff components,and solder alloy advancements. Past history suggests that the clea .. read more

There is a growing problem in the industry with no-clean flux technology and the after effects it can have on reliability. If the fluxes are not fully complexed (not fully heat activated) there .. read more

As the entire electronic manufacturing industry braced for the July 1,2006 deadline,it has been reevaluating the entire production process. Likewise,the precision cleaning industry must also .. read more

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Solving "Fine Pitch" Metric Pitch BGA routing is becoming increasingly challenging for PCB design layout. There are solutions but they are very hard to find. This presentation will cover common .. read more

insure the same quality a customer has been accustomed to with a Sn63Pb37 process is achieved. The reflow,wave soldering and hand assembly processes must all be optimized carefully to insure go .. read more

C4NP (Controlled Collapsed Chip Connection-New Process) is a novel solder bumping technology developed by IBM and commercialized by Suss MicroTec. C4NP is a solder transfer technology where mol .. read more

With the advent of widespread lead-free soldering,the issue of copper erosion has surfaced as a major quality concern when soldering RoHS compliant through-hole devices. Many contract electroni .. read more

Due to the ever-aggressive miniaturization program that is rolling through the electronics industry,the next component that is fast approaching this horizon is the 0.3mm CSP • This paper will r .. read more

As electronic packages keep shrinking in size,high-speed high-accuracy package assembly equipment are becoming more sensitive to mechanical vibrations. Alignment,positional and pick & place acc .. read more

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CTE mismatches during temperature cycling can cause significant movement of components and materials relative to one another,which in turn stresses solder joints and wirebonds. Silicones are of .. read more

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While glass fibers are commonly used to reinforce circuit board substrates,they have a high dielectric constant and loss. Cyclic olefin copolymer fibers have a lower dielectric constant and los .. read more

Silicones are often used to protect electronic applications designed for cold environments. The low temperature flexibility of silicones is well recognized,but not as well understood. While the .. read more

The regulation requiring lead-free solders for printed circuit boards (PCBs) has presented a number of challenges to our industry at virtually every stage of the process. For the brominated epo .. read more

The proposed revision of IPC-4101 - Specification for Base Materials for Rigid and Multilayer Printed Boards contains new slash sheets describing FR-4 base materials compatible with lead free a .. read more

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Recent global environmental regulations affecting consumer electronics and electrical equipment,such as the European Union’s RoHS Directive,China ‘RoHS’ and others,have driven electronics manuf .. read more

Many large Original Equipment Manufacturers (OEMs) have a detailed procedure and a significant capital investment in place for the selection of printed circuit board suppliers. This approval pr .. read more

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Embedding capacitive layers inside the Printed Circuit Board (PCB) have demonstrated the ability to reduce the number of Surface Mount Technology (SMT) chip decoupling capacitors on the PCB sur .. read more

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More and more countries are beginning eco-compliance legislation for electronics products. Where does the USA stand? The rest of North America? This paper will discuss the following areas and a .. read more

Focus: Benefits of switching from a reactive to proactive ECR system Even with the RoHS deadline come and gone,most the ECR systems employed by suppliers follow the “reactive” model. Many suppl .. read more

As more governments pass,implement,and enforce environmental compliance initiatives covering electronics,small to medium sized businesses continue to struggle with what data should be tracked,h .. read more

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It is clear that the future belongs to the ever shrinking component. Micro Lead Frame (MLF) components,and specifically the Quad Flat No-lead (QFN) packages have gained wide scale acceptance. .. read more

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