IPC Conference Paper Archive

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Solving "Fine Pitch" Metric Pitch BGA routing is becoming increasingly challenging for PCB design layout. There are solutions but they are very hard to find. This presentation will cover common .. read more

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The IPC's Lead Free program addresses one of the 6 Hazardous Substances regulated by the RoHS directive. Certification to the QC 080000,the IECQ HSPM Specification,addresses the other 5 Hazardo .. read more

Tetrabromobisphenol-A (TBBPA) is a commercial flame retardant used in rigid FR-4 printed wiring boards (PWB). It is the single largest volume brominated flame retardant in the world. In this ap .. read more

The European Union passed two directives in 2003 addressing the increasing amount of waste from electric and electronic equipment: (1) Directives 2002/96/ECi – Waste Electrical and Electronic E .. read more

The continuous temperature resistance of electrically insulating materials can be judged by examining the effect of thermal stress loads on the electrical properties,such as moisture and insula .. read more

Society today relies on electronic devices that influence every aspect of our lives,such as communication,transportation,computing,home appliances,and recreation. The reliability of any electro .. read more

To improve the design efficiency of a micro drill bit,a method on the basis of the combination of theoretical analysis,numerical simulation and experimental verifications is presented. As examp .. read more

boards in the in-line aqueous cleaning process. As lead-free circuit boards become more complex and component spacing decreases,the effectiveness of direct blow-off drying is greatly diminished .. read more

An important development in high reliability electronics is the convergence of circuit board and advanced packaging technologies. This combination enhances the best attributes of each technolog .. read more

The hidden cost of optical inspection systems is often in the programming time. In this paper we discuss a new AOI programming and inspection paradigm reduces the need for human intervention an .. read more

As printed circuit board assembly (PCBA) becomes more complex,Automatic Optical Inspection (AOI) and Automatic Xray Inspection (AXI) systems are becoming more widely used in electronics manufac .. read more

The Quad Flat No-Lead or QFN packages are increasing in their utilization in the printed circuit board market. This is being driven largely by the shrinking size both in profile and footprint,h .. read more

The routing of large pin-count and dense BGAs has a significant impact on the cost of the PCB,primarily in terms of layer count and via technology. This paper is the result of considerable rese .. read more

With design requirements becoming more stringent as implementation of new technology standards evolve,designers are faced with the challenge of front-loading more effort in the design cycle tha .. read more

A perplexing challenge for RoHS compliance is adapting large,complex and thick,high-layer count multilayers to lead-free assembly. These are typically dense,complex assemblies with large BGAs a .. read more

Environmental compliance is becoming a global effort in the electrical and electronics industry. The Directive on “Restriction of Hazardous Substances” (RoHS) in Europe,is forcing the electroni .. read more

RoHS directives require screening and quantification of certain elements and compounds used in electronics components and parts. X-ray Fluorescence (XRF) technology has emerged as an effective .. read more

With the enactment of the European Union (EU) ROHS Directive 2002/95/EC (Ref.1),certain electrical and electronic products that are manufactured in or exported to the European Union have restri .. read more

Increasing operating frequency of IO busses for computing has highlighted the importance of transmission line loss. For FR4 PCB mother boards computing at speeds above 1 GHz this is dominated b .. read more

A new bifunctional low molecular weight polyphenylene ether (OPE oligophenylene ether) was obtained by the oxidative coupling of 2,2’,3,3’,5,5’-hexamethyl-[1,1’-biphenyl]-4,4’-diol (HMBP hexame .. read more

While glass fibers are commonly used to reinforce circuit board substrates,they have a high dielectric constant and loss. Cyclic olefin copolymer fibers have a lower dielectric constant and los .. read more

This paper analyzes the differences in plated through hole fill performance between the regular OSP and Pb-free OSP PCB surface finish chemistries in a Pb-free wave solder process. The variable .. read more

Organic Solderability Preservatives (OSP) continue to attract significant attention as circuit board final finishes. They have evolved from simple and thin benzotriazole coatings to thicker and .. read more

The data from the IPC Alternate Finishes Task Group Report “Time,Temperature and Humidity Stress for Final Finish Board Solderability” has been analyzed in a greater depth than in the actual re .. read more

We present the electrical characterization of our Liquid Crystal Polymer (LCP) at microwave and millimeter frequencies and the applications of LCP to circuit components. We use several methodol .. read more

In this paper,factors that influence the ability for a flex circuit,especially a multilayer flex circuit,to survive the lead-free soldering and other thermal processes during the circuit fabric .. read more

The challenge manufactures face when competing in the world marketplace is to offer a product that will meet all performance and functionality expectations without increasing product size or co .. read more

Copyright,like all other forms of intellectual property,is based on negative rights. A copyright registrant may exclude others from reproducing a given copyrighted work,composing a derivative w .. read more

Transitioning to offshore sourcing has become a seductive argument for cost reduction. Most managers agree that the impact has been beneficial to the consumer and the trading conglomerates. Thi .. read more

The whisker concern has been greatly affecting lead free RoHS conversion confidence in the lead frame packages,particularly for high end product conversion. Although plenty of related study in .. read more

The RoHS legislation in Europe has far reaching consequences,which necessitates a change in lead coating on component leads. Although some suppliers are using a tin finish,there is a tendency f .. read more

Oxide alternatives,as well as traditional and reduced oxide chemistries,are coatings or “adhesion promoters” used to enhance the bond between imaged and etched inner layer copper surfaces and t .. read more

In the printed circuit board industry there are generally two main types of circuit boards; there are rigid printed circuit boards and flexible printed circuit boards. There is a tremendous var .. read more

Precise control of coating deposition is critical to the application of conformal coatings to selected areas of printed circuit board assemblies. The coating must be applied in a defined patter .. read more

The level of protection offered by a range of conformal coatings on electronic assemblies has been evaluated. The role of permeability and ion transport is the primary interest. Testing was car .. read more

In the global Electronic Manufacturing Services (EMS) market,we constantly hear news of the major ("Big 6") players—Foxconn,Flextronics,Sanmina-SCI,Solectron,Celestica,Jabil—as well as others. .. read more

Research has shown that U.S. companies can realize higher profits over outsourcing by putting their houses in order and finetuning their production processes,with automation being a key contrib .. read more

The pressure to reduce overall form-factor size in the high volume chassis desktop market is driving the need to integrate components at the system level. Adding to the challenge of size reduct .. read more

The debate on the effect of voiding on BGA reliability has continued for years. Many PWB assemblers strive to minimize voiding,particularly with the advent of lead-free processing and in fine f .. read more

On July 1,2006,lead and certain other hazardous materials were banned from most forms of new electronic equipment in the countries of the European Union. Although most aerospace products are no .. read more

The regulatory measures defined in MIL performance standards that govern production of active and passive electronic components ban the application of pure Sn plated leads for EEE parts. The st .. read more

The delamination of electrical grade laminates continues to be a vexing problem for the printed circuit board industry. Laminates are commonly tailored to meet specific thickness and dielectric .. read more

Printed circuit board (PCB) feature sizes are decreasing to support increasing density thrusts for electronic products and packaging. The transition to lead-free products has changed the stress .. read more

This paper compares performance of two phosphorus-based flame retardants: poly-(m-phenylene methyl phosphonate) (PPMP) recently introduced to the market and 9,10-dihydro-9-oxa-10-phosphenanthre .. read more

The Pb-free transition in the electronics industry has seen immersion silver emerge as a leading circuit board finish for RoHS compliant processes and products. It is utilized in a wide cross-s .. read more

Planar microvoids have been observed on second level interconnections between solder metallizations and copper lands on PCB boards with immersion silver surface finish. These planar microvoids .. read more