IPC Conference Paper Archive

The advent of miniaturized electronics for mobile phones and other portable devices has required the assembly of smaller and smaller components. Currently 01005 passives and 0.3 mm CSPs are som .. read more

The purpose of this study is to investigate the optimum plasma processing as a pre-treatment for the surface of Polyimide (PI) in order to increase adhesion strength of electroless copper (Cu) .. read more

This paper discusses a new technology to improve etching performance using shiny side surface treatment on copper foil. Until now,a lot of electro-deposited copper foils (ED foil) with very low .. read more

As PCB designs become ever more complex with more sequential build up layers,tighter annular ring designs and broader range of advanced materials,understanding the effect of material distortion .. read more

A new technology for MLB pressing has been developed by MBT and industry partners,called TOP,Temperature Optimised Process. The goal was to reduce energy consumption and to improve product qual .. read more

There are presently several techniques for forming a buried capacitor in the core of a multilayer board. For purposes of this discussion,attention will be directed toward a sheet capacitor; alt .. read more

Embedded passives,especially embedded resistors and capacitors have been a hot topic since the mid-to-late 1990s. It is easy to understand why they have generated so much interest. Technology c .. read more

The following article is a series of “from the trenches” stories,taken both from the perspective of an electronics manufacturer and an environmental compliance consultancy. The accounts below p .. read more

Within today’s Consumer Electronics Industry,a laboratory report listing elemental content is standard protocol. Understanding the information listed within a lab report can be difficult and un .. read more

Although the advantages of Hot Air Solder Leveling (HASL) in providing the most robust solderable finish for printed circuit boards are well recognized,in the years leading up to the implementa .. read more

As the electronic industry moves to lead-free assembly and finer-pitch circuits,widely used printed wiring board (PWB) finish,SnPb HASL,has been replaced with lead-free and coplanar PWB finishe .. read more

Moore’s Law infers that the number of transistors on a chip doubles approximately every two years. Consistent with Moore’s Law,high reliability electronic devices build faster processing speed .. read more

The areas of entrapment on cleaned and no-clean assemblies are showing higher levels of contamination around BGA’s,in microvias and particularly under components like the QFN. Flux residues tra .. read more

With greater time to market and time to volume pressures,manufacturers of populated printed circuit boards have traditionally relied upon un-powered vectorless testing to quickly and reliably i .. read more

In today’s manufacturing world,higher equipment utilization and lower operating cost is the way forward. Newer machineries are usually well equipped to get the job done as they are manufactured .. read more

Many flat panel display technologies were developed and commercialized since 1980s. Today,liquid crystal display panels (LCD) and plasma display panels (PDP) have the lion’s share of the large .. read more

Previously,the general understanding about polymer-base thick film flexible circuits consisted of low density with low electrical conductivity because of the organic matrix in the conductor mat .. read more

Green Design has recently gained significant interest in the electronics industry all over the world and will remain one of the hottest topics for the upcoming years. Besides reduction of consu .. read more

Since the early days of PWBs,liquid photoresists and soldermasks have played indispensable roles in the manufacturing process. From the introduction of the original Kodak Photo Resist (KPR) and .. read more

The electronics industry continues to strive to provide more environmentally friendly products. This movement is partly due to legislation from various countries,partly due to public outcry fro .. read more

During the process from wafer fabrication to completing the final plastic package there are a number of upstream processes that negatively impact subsequent operations. Problems at wirebond can .. read more

Flip chip bonding is the most desirable direct chip attachment approach for minimizing electronic assembly size as well as improving device performance. For most prototyping applications it is .. read more

This paper is focused on the impact of solder hole fill on the reliability of the plated-through-hole (PTH) solder joints with different board thicknesses. Finite element analysis (FEA) is empl .. read more

During the last 5 years,the processes to remove flux residues especially for lead-free and challenging geometries have demonstrated new cleaning obstacles which have to be overcome.i A new meth .. read more

Implementation of lead-free soldering technology has created new interest in high performance cleaning of printed circuit assemblies (PCAs). Many studies have been commissioned regarding remova .. read more

Batch cleaning of electronic assemblies is popular in all regions of the world and continues to grow due to its flexibility,ease-of-use and economic considerations. Batch spray-in-air processes .. read more

All but the most simple circuit boards processed in recent times are inspected using in-circuit testing,ICT. In order to test on pads or connections printed with no-clean solder paste; the post .. read more

Due to In-Circuit Test issues probing difficult to penetrate processes such as Pb-free solder,OSP (Organic Solderability Preservative),Immersion Au (Gold),Ag (Silver),Sn (Tin) and No-Clean,as w .. read more

•Rewards businesses with a dollar for dollar reduction of tax •Rewards “evolutionary” and “revolutionary” activities •Federal tax benefit can be as high as 6.5% of investment in new products an .. read more

Companies seeking sales or suppliers in the global marketplace must proceed with caution. This presentation provides an overview of U.S. regulation of import and export transactions. Importers .. read more

Flux technology for lead-free alloys differs considerably from that for eutectic Sn/Pb solder systems,mainly for soldering and cleaning purpose. For most of the lead-free solders,paste handling .. read more

It is known that pure tin will undergo an allotropic transformation below 13°C where it becomes a semiconductor with a 26% volume increase,and in appearance turns from a bright shiny metallic m .. read more

Addition of Al into SAC alloys reduces the number of hard Ag3Sn and Cu6Sn5 IMC particles,and forms larger,softer non-stoichiometric AlAg and AlCu particles. This results in a significant reduct .. read more

An assessment to measure the cleanliness of the area underneath a component has been completed. The assessment uses an 8”×9”×0.093” test vehicle with FR4 laminate,OSP surface finishing,and 21 p .. read more

Electronics,especially mobile electronic items,are subjected to unintentional abuse by having various beverages spilled onto or into them. Ion Chromatography and emission spectroscopy were used .. read more

Over 3 years ago,Zestron initially addressed cleaning underneath 4 MIL standoff components. With the emergence of lead-free and even smaller components new challenges have now arisen to include .. read more

The recent use of lead free alloys has made the wave solder process more challenging in terms of achieving acceptable solder joints for both SMT and PTH components. It has been found that the D .. read more

This paper presents lead-free ball grid array (BGA) packages subjected to two ball removal and two ball attachment techniques. Solder attach strength is used as a metric to examine the reballin .. read more

As early as 2001,leading cellular phone manufacturers had established stable assembly processes that were RoHS compliant for their cellular phone products. Since this time,the products manufact .. read more

The use of an insoluble anode in place of standard copper anodes (slab or titanium baskets filled with copper) improves the quality of plating,increases the productivity of the plating line,red .. read more

The Semiconductor industry is demanding more and more from today’s PWB manufacturers. This paper offers some insights to the needs,requirements,solutions and process verifications that R&D Circ .. read more

The peel test will be reviewed,with special attention given to deposited adhesiveless copperclad laminates. A basic familiarity with the IPC test method will be assumed. The brief amount of tim .. read more

We demonstrate here a novel CCL (Copper Clad Laminate) which exhibits an extremely low transmission loss at mm-wave band. The CCL which we developed is based on a new fluoropolymer with adhesiv .. read more

Over these years,EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trend,signal integrity performance gets more critical upon today’s h .. read more

Since July 1st 2006,the 2002/95/EC RoHS European directive has forced the electronic industry to switch from Tin-Lead to lead-free soldering alloys for components assembly. Exemption domains ha .. read more

Although the official implementation of the EU Restriction of Hazardous Substances (RoHS) directive officially started on July 1,2006,a significant portion of the avionics electronics supply ch .. read more

REACH presents a new set of direct and indirect risks for article manufacturers,including electronics manufacturers. Direct risks arise from obligations explicitly outlined in the REACH regulat .. read more

Following the implementation of WEEE legislation,there will be an increasing interest in adopting more sustainable manufacturing processes and materials as targets are increased,and must be ach .. read more

The purpose of this paper is to demonstrate the value of mathematical modeling of PCB processes. This approach will identify the first order variables that control the process and the relative .. read more

Conductive Anodic Filament(CAF) that is one of the copper migration phenomena becomes significant problem with higher density circuit for printed circuit board.(PCB) In the past CAF property wa .. read more