IPC Conference Paper Archive

A process called computational reliability modeling is described herein as well as how the reliability predictions from this modeling approach match experimental data (both lead and lead-free s .. read more

A common source of defects on area array components is the “ball-in-socket” (or “pillowhead”) defect. This defect is defined as one or more connections that show physical contact but no wetting .. read more

Solder joint void has been considered a typical phenomenon in electronics assembly. Voids are caused by entrapped gases produced during flux volatilization during SMT,air entrapment in plated t .. read more

High Frequency and Lead-Free laminate materials are finding increased use in the PWB fabrication industry driven by end user requirements for high-speed signal transmission and lead-free solder .. read more

When manufacturing printed wiring boards and assemblies it is often necessary to cover certain areas prior to soldering operations in order to avoid them being wetted with solder. Such areas ma .. read more

With the latest legislations from RoHS and WEEE dominating the horizon of the PCB landscape there is a need for manufacturers and their suppliers to understand their impacts. The requirement to .. read more

Following previous reports by the authors on the general properties of a novel immersion silver process,this paper presents the production experience in typical horizontal lines to demonstrate .. read more

The advent of surface mount technology and now the lead free issue have ushered in a new wave of solderability treatments, in particular the flat hard metal finishes. Among others these include .. read more

In order to meet the growing requirement of eliminating lead from electronics,the printed wiring board (PWB) industry is migrating from hot-air-leveled solder (Sn/Pb) to lead free compatible al .. read more

Chip scale packages (CSPs) are widely used in portable electronic products. Mechanical drop testing is a critical reliability requirement for these products. With the switch to lead free solder .. read more

The movement to Pb-free soldering will result in solder joints that are significantly stiffer than those made of SnPb. This paper presents the results from the first phase of a two-part study t .. read more

In response to RoHS and other international environmental legislation,the semiconductor industry is moving toward the elimination of lead (Pb) from packages. During the transitional period,both .. read more

In these days of high mix low volume there is increasing pressure on the SMT departments of manufacturing companies to reduce changeover times and increase machinery utilization. An enormous ef .. read more

Selecting an optimal test strategy is a complex task today. There are many test inspection and test methods available. The most common choices to find manufacturing defects on printed circuit b .. read more

Volume electronic manufacturing environments are constantly seeking solutions to bottlenecks at end-of-line test. Bottlenecks are being seen increasingly on high volume automotive,telecomm & co .. read more

Over the past ten years,two new test methods: Interconnect Stress Test [1] and Highly Accelerated Thermal Shock [2] have been developed to perform thermal cycling testing and in particular,to m .. read more

The surface finishes Ni-P/Pd/Au (hereafter referred to ENEPIG) and Ni-P/Au (hereafter referred to ENIG) were prepared on ball grid array (BGA) circuit boards by electroless/immersion plating me .. read more

Today both Interconnect Stress Test (IST) and Highly Accelerated Thermal Shock (HATS) test methods are used to measure plated through hole via reliability. Both of these test methods have prove .. read more

Continuous measling,or unidirectional crazing,was observed in a multi-layer polyimide printed wiring board following assembly operations. Damage to the PWB preferentially followed the warp dire .. read more

Nanocrystalline and ultra-fine grain copper can potentially offer increased reliability and functionality of printed wiring boards due to expected enhancements in strength and achievable wiring .. read more

This paper addresses the effect of pulse plating of electronic interconnects for advanced electronic modules. This paper builds on earlier work by correlating plating cell and tank design issue .. read more

With the combination of increased product complexity,increased frequencies and ever decreasing component sizes and pitches designers are faced with the dilemma on how design their products in t .. read more

The constant drive by designers to create more functionally unique products has challenged the assembly community for some time. As a result,many processes have been developed under the “Necess .. read more

Meeting the RoHS directive will require the transition from the historical tin-lead based system of materials to one that does not contain lead. This is of course is not straight forward as it .. read more

Lift-off (fillet-lifting) and land-lifting phenomena,which occur in wave soldering with Sn-Ag-Cu (SAC) solders,depend on the physical properties of the solder and the laminate material used. A .. read more

Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting,the microstructure (in particular t .. read more

The in-circuit test (ICT) of printed circuit boards (PCBs) assembled with Lead Free solder was anticipated to be problematic by industry test engineers,due to contact failures associated with t .. read more

Many professionals in the electronics manufacturing industry have,or eventually will,face the issue of determining whether the materials of construction for printed wiring assemblies (PWAs) are .. read more

Reliability of RoHS compliant products is investigated in this study. Emphasis is placed on the lead free solder joint reliability. Solder is the electrical and mechanical “glue” of electronics .. read more

Meeting RoHS requirements is confusing at best. Currently,RoHS bans the presence of 6 substances,: Lead (Pb),Cadmium (Cd),Mercury (Hg),Hexavalent Chromium (Cr6+),Polybrominated biphenyl (PBB) a .. read more

Hand-held communication and entertainment products continue to dominate the consumer markets worldwide,and with each generation,companies are offering more and more features and/or capability. .. read more

Thermoset epoxies,discovered nearly 80 years ago,remain the workhorse materials for electronic packaging and printed circuit boards,but this may change with increasing technical,economic and re .. read more

The assembly of thinned silicon die (25-100µm) onto flex substrates provides options for ultra thin,flexible electronics for applications ranging from smart cards to space-based radars. For hig .. read more

Plastic IC Packages are generally considered to be not as reliable as their ceramic counterparts. One of the major reasons is the question of hermeticity. Plastic materials generally allow mois .. read more

Area Array Packages (AAPs) with 1.27 mm pitch have been the packages of choice for commercial applications; they are now starting to be implemented for use in military and aerospace application .. read more

Conductive Anodic Filament (CAF) is a failure mode in printed wiring boards (PWBs) which occurs under high humidity and high voltage gradient conditions. The filament,a copper salt,grows from a .. read more

The Chinese printed circuit industry has seen rapid growth in the past years,from barely nothing to more than 6.05 billion USD production value in 2003. The association of the industry,CPCA,als .. read more

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Component Material Declarations are a key building block for all OEMs (Original Equipment Manufacturer) and CMs (Contract Manufacturer) preparing a sound due diligence case for RoHS Compliance. .. read more

As the electronics industry prepares for the elimination of the six chemical substances banned by the European Union’s Restriction of the Use of Certain Hazardous Substances in Electrical and E .. read more

The widespread use of electrotechnical products has drawn increased attention to their impact on the environment. In many countries all over the world this has resulted in the adaptation of reg .. read more

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In response to growing concerns about the effects of hazardous materials in the waste stream on the environment,the European Union (EU) passed a directive in 2002 entitled the Restriction of th .. read more

Due to the European legislations (RoHS and WEEE) consumer products need to be soldered with lead-free solders from the first of July 2006. Since several properties (physical,chemical,mechanical .. read more

As the global electronic industry marches toward the brave new world of environmentally conscious electronic manufacturing,lead free soldering has made some fundamental shifts in the processing .. read more

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The following report is fundamentally focused on how three popular lead-free alloys react in a wave solder application. The alloys were SAC305,SAC405 and a proprietary,low silver SAC alloy. In .. read more

Traditionally microvias have been considered to be the most reliable interconnect structure within a printed wiring board (PWB). With the advent of lead free assembly the vulnerability of high .. read more