IPC Conference Paper Archive

Supply chain readiness and compatibility are critical to a smooth transition to environmental compliance for the worldwide electronics industry. This paper reviews the status of Lead Free solde .. read more

Whether based on good science or not,the elimination of lead from electronic equipment as a result of the European RoHS legislation is a reality. Even those market segments with exemptions mean .. read more

Layout designers play a critical role in the design of high-speed circuits. In an optimized process,they take constraints defined by engineering and create a layout that adheres to those design .. read more

During the design phase of a project,distribution of metal on the external layers of printed circuit boards is not a consideration. System designers concentrate on implementing the required log .. read more

Today,there exists a major push towards lead free soldering in the international electronics industry. It has presented a number of challenges in both the surface mount and wave soldering proce .. read more

Dross generation has always been a costly issue for the electronics assembly industry. At least half,and in many cases,more than half of the metal (solder) purchased for electronic manufacture .. read more

The challenges for today’s PCBs are many,including higher assembly temperatures and higher device heat transfer temperatures; faster clock cycles and higher bandwidths; higher component density .. read more

Beginning July 2006,the electronic industry will enter the age of lead –free assembly and products in Europe. The removal of lead from electronics brings massive changes for all companies in th .. read more

Vacuum-condensation soldering is a new process,developed to combine the advantages of condensation soldering and vacuum soldering. The lecture introduces the results of the project development, .. read more

One of the reported problems in moving to lead free has been increased solder voiding. Current research indicates that paste formulation,reflow profile and board finish,when selected carefully, .. read more

The widespread use of SAC-based (SnAgCu) lead-free solder paste drives the industry toward reflow profiles that are considerably longer than those used for lead-bearing products. This is due to .. read more

One of the factors that has contributed to the establishment of the Ni-modified Sn-Cu eutectic as one of the major alternatives to the widely promoted Sn-Ag-Cu alloys as an RoHS compliant lead- .. read more

Status of thermal cycle test results for a nonfunctional daisy-chained peripheral ceramic column grid array (CCGA) and its plastic ball grid array (PBGA) version,both having 560 I/Os,were prese .. read more

Legitimate concern exists regarding sending spacecraft and their associated hardware to solar system bodies where they could possibly contaminate the body’s surface with terrestrial microorgani .. read more

Over the last several years there has been a great deal of advancement in post-print inspection technology. The capability to inspect printed solder paste deposits immediately after the printin .. read more

With the introduction of Lead-free solder,voiding within BGA joints is potentially a major issue during PCBA manufacture. With BGA components sometimes costing hundreds or even thousands of US .. read more

This paper presents data collected from a set of electronics manufacturers using an automated optical inspection post-place system for the purpose of both defect detection and process-control a .. read more

Carbon Composite raw material property comparison are summarized below: -Thermal Conductivity – Watts per meter ? Kelvin. The core material can spread up to 620.0 W/m?K. -CTE – parts per millio .. read more

Nowadays,the growth of electronic industry is remarkable. All electronic devices are getting smaller with higher performance and data transmission speed. Therefore,we have developed a new profi .. read more

At the same time the electronics industry is moving towards higher power and faster clock speed,components are becoming smaller in size and packed more densely on circuit boards. Together these .. read more

The electronic industry has been migrating to lead-free solder alloys by legislation forces. In Europe the WEEE/RoHS are scheduled to ban Pb alloys in July 2006. China is in process of preparin .. read more

European directive2002/95/EC (RoHS) bans the use of several substances for electronic assemblies by July 2006. These regulations have a great impact on the Electronic Packaging and Interconnect .. read more

For more than two years,experts,authorities and sales people in the electronic industry have talked about WEEE and RoHS. In most cases,it has been theoretical and few companies in Scandinavia h .. read more

Thermal cycle testing is being conducted by Boeing Phantom Works (Seattle) for the Joint Council on Aging Aircraft/Joint Group on Pollution Prevention (JCAA/JG-PP) No-Lead Solder Project. The J .. read more

The use of conventional tin-lead (Sn/Pb) solder in circuit board manufacturing is under ever-increasing political scrutiny due to environmental issues and new regulations concerning lead,such a .. read more

A combined environment testing was conducted for the Joint Council on Aging Aircraft/Joint Group on Pollution Prevention Lead free Solder project. The purpose of the project was to validate and .. read more

Technology requirements within the electronics industry are rapidly driving the miniaturization of and increasing component densities on the printed circuit board. As a result,assembly equipmen .. read more

Solder paste dispensing is not a new process. However,today’s microelectronics present a daunting array of technical challenges to meet deposit size requirements. The need for better paste form .. read more

Today’s advanced packages for electronics are required to meet a wide range of requirements for reliability,size and cost. Surface mount technology still prevails in low cost electronics (telev .. read more

Since early last decade,scientists had succeeded in applying printing-related technologies to create organic field effect transistors (OFETs) with micron-sized features. This has led to a wide- .. read more

Many articles have been published on the benefit of thin substrates for use as embedded capacitor layers as well as thin film resistive material for embedded resistors. Until now the utilizatio .. read more

Buried sheet capacitance has been used for sometime in sophisticated PCB designs. The ZBC 2000TM patented by the Sanmina Corporation is a familiar example. Conceptually,this product consists of .. read more

The trend towards miniaturization has been with us for quite a while,with marketing departments pressuring for ever-smaller dimensions for everything. A question that arises frequently in this .. read more

Rarely does a day pass by without a discussion centered on lead free manufacturing and it’s future impact on global electronics assembly. The WEEE and RoHS directives drafted in January 2003 wi .. read more

A brand name Pb-free solder paste made with three different sizes of solder paste spheres was studied. The soldering ability of Types III,IV and V solder paste in terms of opens,shorts,solder s .. read more

Many words have been written about the impending lead free transition,during this period of frantic discovery lots has been communicated about the reflow and alloy concerns; But the print proce .. read more

Elevated SMT reflow temperatures for Pb-free soldering are placing excessive thermal demands on certain families of electronic components. The High Density Package Users Group,HDPUG,Consortium .. read more

The Pb-free solder interconnect reliability performance of a wide variety of common SMT component types was measured in an IPC-9701 TC1 thermal cycle (0-100°C / 40 min cycle). Seventeen differe .. read more

Bare printed wiring board materials require changes from today’s typical standard dicy cured FR4 materials in order to support lead-free assembly. The High Density Packaging User’s Group has co .. read more

Vibration testing was conducted by Boeing Phantom Works (Seattle) for the Joint Council on Aging Aircraft/Joint Group on Pollution Prevention (JCAA/JG-PP) No-Lead Solder Project. The JCAA/JG-PP .. read more

The American Competitiveness Institute (ACI) performed a series of Environmental Stress Tests for the Joint Group of Pollution Prevention / Joint Council of Aging Aircraft (JG-PP / JCAA) Lead F .. read more

A fluxless bonding process between silicon and copper using Sn-rich Ag-Sn-Au multilayer composite has been developed. The copper substrate is plated with a silver layer as stress buffer. We bon .. read more

The kinetics of activator disappearance were investigated for a wave-soldering flux containing two activators,succinic and glutaric acids. Three loadings of flux were applied to bare FR4 panels .. read more

Flexible printed circuits are a growing technology both in terms of numbers and in technology advancement. Applied as cabling harness technology,IC packaging and as replacement for rigid board .. read more

Flexible circuit interconnects for ultrasound transducer applications are among the most difficult to fabricate and make good representative circuits for medical applications. The polyimide die .. read more

For this study,researchers from the University of Toronto produced samples of Sn-Pb solder,with additions of bismuth, solidified at controlled cooling rates. The microstructure of the various B .. read more

The New England Lead-free Electronics Consortium is a collaborative effort of New England companies spanning the electronics supply chain,sponsored by the Toxics Use Reduction Institute,the U.S .. read more

Consistently achieving acceptable wave solder through-hole fill on thick boards is a well-known process challenge,but the introduction of lead free solders has created additional difficulties. .. read more

No two printed circuit boards look exactly alike. Even across two adjacent boards on an assembly line,one can find significant differences arising out of normal process variation – the componen .. read more

By now,most people in the industry understand how complex it is to convert a factory from using a Tin-Lead (Eutectic) Solder process to a Lead Free process. The implementation of this change re .. read more