IPC Conference Paper Archive

All areas of manufacturing worldwide are impacted by the lead free initiative; none more than the reflow process. The higher melt temperatures and soak duration of leadless solder formulas requ .. read more

The Information and Electronic Warfare Systems business of BAE SYSTEMS Information and Electronic Systems Integration,Inc. (“BAE SYSTEMS IEWS”),a subsidiary of BAE SYSTEMS North America,is invo .. read more

During the last years Flip Chip Technology has been widely accepted as a means for maximum miniaturization of microelectronic assemblies. As an example the use of Flip Chips in advanced product .. read more

With the advent of hard die coated microelectronic assemblies; the ability to perform visual inspections for quality control and failure analysis has been seriously hindered. Analysts have had .. read more

The High Density Packaging Users Group (HDPUG) has conducted a substantial study of solder joint reliability of high-density packages using lead-free solder. The design,material,and assembly pr .. read more

The lead-free solder-joint reliability of the high-density packages,256-pin PBGA (plastic ball grid array),388-pin PBGA,and 1657-pin CCGA (ceramic column grid array),on PCB (printed circuit boa .. read more

Temperature cycling test and statistical analysis of various high-density packages on PCBs with SnCu HASL,NiAu, and OSP finishes are investigated in this study. Emphasis is placed on the determ .. read more

Failure analyses of the leadfree and SnPb solder joints of high-density packages such as the PBGA (plastic ball grid array) and the CCGA (ceramic column grid array) soldered on SnCu HASL (hot-a .. read more

Adhesiveless copper on polyimide substrates are used extensively for high density,flexible circuit applications. A typical construction includes the polyimide substrate,a thin vacuum deposited .. read more

Solder is used in polyimide-based flexible circuits for interconnect applications. But it cannot be used with polyester and epoxy based substrates because of the low temperature tolerance of th .. read more

A new oxide chemistry has been developed which solves many of the annoying properties of the currently available alternate oxides. The process is simple to operate,even simpler to maintain,requ .. read more

Multiple soldering assembly steps are essentially standard for PWBs based on current technologies and needs. A variety of tests are currently in use to evaluate the performance of finished PWBs .. read more

There are a number of organic,inorganic,and hybrid inorganic waveguide materials that are currently being used for a wide variety of optical interconnect applications. Depending upon the approa .. read more

The information age has arrived. A growing percentage of the Earth’s population now has access to pagers,cellular phones,computers,personal digital assistants (PDA’s),and a host of other electr .. read more

The IPC-PCQR2 (Process Capability,Quality and Relative Reliability) program has developed a library of process capability panel designs,and a database that details the manufacturing capability, .. read more

BGAs are usually solder-reflowed on substrates,which are frequently made of a different material than that of the BGAs,which results in a TCE Mismatch between the components. If such an assembl .. read more

Copper migration such as conductive anodic filaments (CAF) has become a serious problem for printed wiring boards (PWBs). As the relation between CAF and matrix resin properties is not clear,th .. read more

This paper discusses the results of Conductive Anodic Filament (CAF) testing of three types of reinforced microvia dielectrics using a CAF test specific Printed Circuit Board (PCB). Quantitativ .. read more

In the best selling book “Who Moved My Cheese”, author Spencer Johnson tells the story of four characters—mice named Sniff,Scurry,Hem and Haw--who are in search of cheese within a maze. Once th .. read more

Increasing global interest in environmental protection is leading to a higher demand for halogen-free materials that can be used as the base materials for the printed wiring boards (PWBs) in el .. read more

Combination grid-prober (CGP) testing is being employed with increasing frequency as the density of SMD lands on boards continues to increase. A number of factors are at work. Grid testers,as a .. read more

In order to evaluate the relative merits of halogenated and alternative flame-retardants used in PWB’s,a comparison between several different PWB’s each having different flame-retardant package .. read more

Customer demands concerning thermal stability of PCB base materials are increasing. Rising complexity of printed circuit boards requires an improved quality of the dielectric in terms of cleanl .. read more

Predicting printed circuit board (PCB) thickness has not historically been a difficult task. With lower layer count boards you can afford for the prediction per layer to be wrong by a relativel .. read more

Horizontal conveyorized spray processing is the most prevalent method for the production of circuit panels in the industry today. However,as line and space requirements fall below 4 mils (100µm .. read more

Various Ag-filled epoxies were subjected to a current carrying capability study in which current was applied to the epoxies at temperatures of up to 170°C for 1008 hours. Test devices with Ag e .. read more

In the present as in the past,printed circuit board conductors are sized using simple charts that are a function of cross-sectional area,current level and conductor temperature rise. These char .. read more

Over the last five to eight years the use of HASL alternatives by the OEM’s and CM’s has increased dramatically,particularly in response to increasing board density and the need for a solderabl .. read more

There are many board finishes in use today and the EMS provider must learn to use many,if not all of them. However,all board finishes do not perform the same during assembly and test operations .. read more

X .. read more

X .. read more

The increased need for smaller,faster,and cheaper electronics has led the microelectronics industry to explore a number of new enabling technologies. Embedding passive components into multi-lay .. read more

Several factors are driving the need for buried passive components in printed circuit boards and chip carriers. Increasing frequency increases the difficulty in quieting noise by the use of sur .. read more

X .. read more

The current technology includes transmission of between optical units (typically modulated laser sender and receiver units) and fiber optic cables or flexible kapton fiber optic cables with whi .. read more

Increasing component density and the requirements of higher performance electronic devices are driving the development of embedded passive devices in the printed circuit board (PCB). The benefi .. read more

As CPUs increase in performance,the number of passive components on the surface of the boards are increasing dramatically. To reduce the number of components,as well as improve the electrical p .. read more

X .. read more

The last 10 years have seen the rise of lasers used in the interconnect industry to a point where their use is almost becoming ‘main stream’. As line width and spacing requirements become small .. read more

For faster,smaller,and high performance integrated circuits the new concept of buried bump interconnect substrates is required. We have developed B2itTM (buried bump interconnection technology .. read more

X .. read more

The need for the high density provided by Build-up PWB installed in the mobile communication products requires the general trend towards a gradually smaller hole diameter. For the micro via dri .. read more

The evolution of interconnection systems for Printed Circuit Boards has been extremely interesting. The first connections were those generated in a copper foil on the surface of a single sided .. read more

X .. read more

Despite the strong increase in demand for high-density circuit boards,very few manufacturers are offering microvia architectures in high volume. Current microvia technologies require significan .. read more

Laser-drilled microvias are being added to the list of approved technologies for printed wiring boards destined for use in a rapidly increasing number of application types and environments. Mic .. read more

X .. read more

With the advent of more flexible versions of pulse-reverse plating technologies,and with the ability to program more of the waveform parameters,comes an increased number of options facing the u .. read more

The multiple die chip-scale package technology (identified as the ?Z™) is a truly innovative,folded-flex stacked packaging technology. The concept has already been proven in a collaborative dev .. read more

With the advent of more flexible versions of pulse-reverse plating technologies,and with the ability to program more of the waveform parameters,comes an increased number of options facing the u .. read more