CHIPS Act Implementation Requires Strong Focus on "Advanced Packaging," Industry Leaders Say
Ever-more complex packaging of chips will be the key driver of future innovation, yet the United States and Europe are behind the curve
Leaders of top semiconductor, microelectronic, IC-Substrate, PCB, EMS, and OSAT companies along with the U.S. government and European Commission gathered in Washington, D.C.
Industry Well Represented on New U.S. Government Advisory Committee on Microelectronics
Two of the electronics industry’s most far-sighted and innovative leaders have been named to the U.S.
Challenging Conditions Ahead for Electronics Manufacturers per IPC’s Global Sentiment of the Electronics Supply Chain Report
Per IPC’s September Global Sentiment of the Electronics Supply Chain Report 81 percent of electronics manufacturers are currently experiencing risin
Likelihood of a Recession in 2023 in the United States and Europe Continues to Increase
IPC releases September 2022 economic outlook report
According to IPC’s September 2022 economic outlook report, the economic picture in the United States continues to dim and the likelihood of a recession ne
EMS North America Industry Report, August 2022
IPC releases EMS industry results for August 2022
IPC announced today the August 2022 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.31.
North American PCB Industry Sales Up 15.1 Percent in August
IPC releases PCB industry results for August 2022
IPC announced today the August 2022 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.