Submit a Standards Improvement Comment
IPC Status of Standardization
Contribute to IPC Standards by Submitting Your Comments
Individuals or companies are invited to submit a comment to IPC on standards improvement via the Standards Improvement form, found on the right. The purpose of this form is to provide the appropriate technical committee of IPC with input from the industry regarding recommendations for published standards or work in progress on new or revisions of standards being worked on. Complete the form on the right and just click on the submit button, a tech staff person will be in touch if there are any questions.
Your technical expertise and comments are critical to the development of IPC standards that cover areas of supply, design, manufacture of boards and finished assemblies. We are continually looking for ways to improve current standards but we are also looking for what might be that next standard the industry. Every idea or comment goes through a rigorous process to meet the criteria for potential standards development for the industry. Once accepted a project is established and the great work of the industry committees starts.
IPC encourages and welcomes individuals from the global electronics industry to submit their ideas or to request to be added to a ballot group as part of the standards development process.
If you are located in Asia Pacific Market -
IPC members in China and Asia are invited to participate through TGAsia Forum, our e-mail forum for discussion of standards development.
IPC Standardization Procedures - provides processes, structure and ANSI policy in developing standards for the electronics industry
Status of Standardization
Standard | Title | Published Date |
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IPC-4203C | Cover and Bonding Material for Flexible Printed Circuitry | April 2025 |
IPC-8981 | Quality and Reliability of E-Textiles Wearables | March 2025 |
IPC-7530B | Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave) | January 2025 |
IPC-6011A | Generic Performance Specification for Printed Boards | January 2025 |
J-STD-001JS | Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies | January 2025 |
J-STD-609C | Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes | January 2025 |
IPC-9716 | Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies | December 2024 |
IPC-1602A | Standard for Printed Board Handling and Storage | November 2024 |
Standard | Title | Published Date |
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IPC-1602A - JP | プリント基板の取扱いと保管に関する規格 | November 2024 |
Standard | Title | |
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IPC-4101F | Specifications for Base Materials for Rigid and Multilayer Printed Boards | |
IPC-4105 | Specification for Metal Base Copper Clad laminates for Rigid Printed Boards | |
IPC-4204C | Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards | |
IPC-4556A | Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards | |
IPC-9242 | Guidelines for Microsection Evaluation | |
IPC-9271 | Guidelines for In-System Programming | |
IPC-9691C | User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing | |
IPC-A-600M | Acceptability of Printed Boards | |
IPC-A-630A | Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures | |
IPC-J-STD-002F | Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires | |
IPC/JPCA-8911 | Requirements for Conductive Yarns for E-Textiles Applications | |
Standard | Title | |
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IPC-1753 WAM2 | Laboratory Report Standard | |
IPC-1755B | Responsible Sourcing of Minerals Data Exchange Standard | |
IPC-1791E | Trusted Electronic Designer, Fabricator and Assembler Requirements | |
IPC-2223F | Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards | |
IPC-2601 | Electronic Product Documentation Standard | |
IPC-6018D Amendment 1 | Qualification and Performance Specification for High Frequency (Microwave) Printed Boards | |
IPC-6921 | Requirements and Acceptance for Organic IC Substrates | |
IPC-7527A | Requirements for Solder Paste Application | |
IPC-9704B | Printed Circuit Assembly Strain Gage Test Guideline | |
IPC-HDBK-005A | Guide to Solder Paste Assessment | |
IPC-HDBK-9798A | Handbook and Guide to Supplement IPC-9797 | |
IPC-T-50P | Terms and Definitions for Interconnecting and Packaging Electronic Circuits | |
J-STD-001JA/IPC-A-610JA | Automotive Addendum to IPC J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610J Acceptability of Electronic Assemblies | |
J-STD-046A | Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers | |
J-STD-048A | Notification Standard for Product Discontinuance | |
Standard | Title | |
---|---|---|
IPC-1753A | Laboratory Report Standard | |
IPC-1783 | International Standard for Component-Level Authentication (CLA) | |
IPC-2553 | Global Standard for Digital Sustainability Credentials | |
IPC-6921 | 有机封装基板的要求与验收 Requirements and Acceptance Specification for Organic IC Substrate | |
IPC-7251 | Generic Requirements for Through-Hole Design and Land Pattern Standard | |
IPC-7621A | Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics | |
IPC-8921A | Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires | |
IPC-8922 | Qualification and Performance Specification for Printed Electronics on Coated or Treated Textiles and E-Textiles | |
IPC-8953 | Design Standard for Embroidered E-Textiles | |
IPC-8961 | Guideline on E-Textiles Wearables | |
IPC-SM-840F | Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials | |
Standard | Title | |
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IPC-2201 | Requirements for Physics of Failure Analysis for Components and Assemblies | |
IPC-2611A | Generic Requirements for Electronic Product Documentation | |
IPC-2612-1A | Sectional Requirements for Electronic Diagramming Symbol Generation Methodology | |
IPC-2612A | Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions) | |
IPC-4557 | Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications | |
IPC-6911 | Acceptability of Additively Manufactured Electronics (AME) | |
IPC-7070 | Guidelines for Printed Board Component Mounting | |
IPC-7077 | Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly | |
IPC-9205 | Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes | |
IPC-HDBK-001A | Handbook and Guide to Supplement J-STD-001G and J-STD-001G - Revision A | |
IPC/JEDEC J-STD-033E | Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices | |
IPC/JEDEC J-STD-609C | Marking, Symbols, and Labels of Leaded and Lead-Free Terminal Finished Materials Used in Electronic Assembly | |
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