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As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai, China.
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As PCB technology advances, design complexity increases
Ongoing communication between designers and fabricators heads off costly problems.
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Cleaning standard update
Revision B to IPC-CH-65 will reflect evolving industry considerations for cleaning.
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IPC-9592, Performance Parameters for Power Conversion Devices
Dr. Scott Strand, senior technical staff member, integrated technology, IBM, provides an overview of IPC-9592.
View the show
IPC market research
Sharon Starr, director of market research for IPC, illustrates some of the industry data available to IPC members and explains how the information can be used to help companies thrive.
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- Au embrittlement
What is the relative difference between joints on copper vs. nickel, as it relates to Au embrittlement? Does Cu inhibit AuSn4 from forming in the bulk solder? Does this have any effect on Au in the intermetallic layer?
- IPC-610, 8.2.5.5
IPC-610 says that solder touching the component body is a defect. But it states that it is allowed for SOTs. Why is it a defect for solder to touch the component body for other component types?
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IPC APEX EXPO™
March 31-April 2, 2009 Las Vegas, Nev.
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IPC Midwest Conference & Exhibition
September 20-24, 2009 Schaumburg, Ill.
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 2008 International Printed Circuit & Electronics Assembly Fair
December 3-5, 2008
Shenzhen, China. |
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